L6460 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

L6460

SPI configurable stepper and DC multi motor driver

STMicroelectronics 

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L6460

General description

Table 2. Pins configuration (continued)

Pin # Pin name

Description

Type

35

GPIO12 General purpose I/O

36

GPIO13 General purpose I/O

37

GPIO14 General purpose I/O

38

N.C.

Not connected

39 DC4_MINUS Bridge 4 phase “minus” output

40 DC4_SENSE Bridge 4 sense output(4)

41 DC3_SENSE Bridge 3 sense output(4)

42 DC3_MINUS Bridge 3 phase “minus” output

43

N.C.

Not connected

44

GPIO11 General purpose I/O

45

GPIO10 General purpose I/O

46

GPIO9 General purpose I/O

47

GPIO5 General purpose I/O

48 DC3_SENSE Bridge 3 sense output(4)

49

N.C.

Not connected

50 DC3_PLUS Bridge 3 phase “plus” output

51

VSupply Main voltage supply

52

nRESET Open drain system reset pin

53

V3v3

Internal 3.3 volt regulator

54

VSupplyInt Internal voltage supply

55

GPIO7 General purpose I/O

56

VGPIO_SPI Low voltage pins power supply

57

GPIO6 General purpose I/O

58 VSWDRV_SW Switching regulator controller source input

59 VSWDRV_GATE Switching driver gate drive pin

60

VPump

Charge pump voltage

61

CPH

Charge pump high switch pin

62

CPL

Charge pump low switch pin

63

64

E_Pad

VSupply

DC1_plus

GND_PAD

Main voltage supply

Bridge 1 phase “plus” output

(1)(2)(3)

Analog In/Out - CMOS bi-dir

Analog In/Out - CMOS bi-dir

Analog In/Out - CMOS bi-dir

Output

Output

Output

Output

Analog In/Out - CMOS bi-dir

Analog In/Out - CMOS bi-dir

Analog In/Out - CMOS bi-dir

Analog In/Out - CMOS bi-dir

Output

Output

Power input

CMOS Input/output

Power Input/output

Power Input

Analog In/Out - CMOS bi-dir

Power input

Analog In/Out - CMOS bi-dir

Power input

Analog output

Power Input/output

Power Input/output

Power Input/output

Power input

Output

1. These pins must be connected all together to a unique PCB ground.

2. Bridges1 and 2 have 2 ground pads: one is bonded to the relative ground pin (GND1 or GND2) and the

other is connected to exposed pad (E_Pad) ground ring. This makes the bond wires testing possible by

forcing a current between E-Pad and GND1 or GND2 pins and using the other pin as sense pin to measure

the resistance of E-Pad bonding. (N.B: grounds of two bridges are internally connected together).

3. The analog ground is connected to exposed pad E-Pad.

4. The pin must be tied to ground if bridge is not used as a stepper motor.

Doc ID 17713 Rev 1

13/139

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