L6562 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6562' PDF : 16 Pages View PDF
L6562
5 Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 27. DIP-8 Mechanical Data & Package Dimensions
DIM.
MIN.
mm
TYP.
MAX.
MIN.
inch
TYP.
MAX.
A
3.32
0.131
a1 0.51
0.020
B 1.15
1.65 0.045
0.065
b 0.356
0.55 0.014
0.022
b1 0.204
0.304 0.008
0.012
D
10.92
0.430
E 7.95
9.75 0.313
0.384
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
6.6
0.260
I
5.08
0.200
L 3.18
3.81 0.125
0.150
Z
1.52
0.060
OUTLINE AND
MECHANICAL DATA
DIP-8
13/16
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