L6599 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6599' PDF : 36 Pages View PDF
L6599
8
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 6. Plastic DIP-16 mechanical data
mm.
inch
Dim.
Min
Typ
Max
Min
Typ
Max
a1
0.51
0.020
B
0.77
1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
E
8.5
e
2.54
e3
17.78
F
7.1
I
5.1
L
3.3
Z
1.27
Figure 35. Plastic DIP-16 package dimensions
0.335
0.100
0.700
0.130
0.787
0.280
0.201
0.050
33/36
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