L6926 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6926' PDF : 17 Pages View PDF
Package mechanical data
6
Package mechanical data
L6926
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Figure 3. MSOP8 mechanical data & package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.10
0.043
A1 0.050
0.150 0.002
0.006
A2 0.750 0.850 0.950 0.03 0.033 0.037
b 0.250
0.400 0.010
0.016
c 0.130
0.230 0.005
0.009
D (1) 2.900 3.000 3.100 0.114 0.118 0.122
E 4.650 4.900 5.150 0.183 0.193 0.20
E1 (1) 2.900 3.000 3.100 0.114 0.118 0.122
e
0.650
0.026
L 0.400 0.550 0.700 0.016 0.022 0.028
L1
0.950
0.037
k
0˚ (min.) 6˚ (max.)
aaa
0.100
0.004
Note: 1. D and F does not include mold flash or protrusions.
Mold flash or potrusions shall not exceed 0.15mm
(.006inch) per side.
OUTLINE AND
MECHANICAL DATA
MSOP8
(Body 3mm)
12/17
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