LCP02-150M View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'LCP02-150M' PDF : 10 Pages View PDF
Package information
3
Package information
LCP02-150M
Table 8. PowerSO-10 Dimensions
Dimensions
HE
h
A
F
A1
E4
10
6
1
5
e
B
0.25 M
D
D1
B
0.10 A B
E2
E3 E1
DETAIL "A"
SEATING
PLANE
A
C
Q
SEATING
PLANE
A1
L
DETAIL "A"
a
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 3.35
A1 0.00
3.65 0.131
0.10 0.00
0.143
0.004
B 0.40
C 0.35
D 9.40
0.60 0.016
0.55 0.014
9.60 0.370
0.024
0.022
0.378
D1 7.40
E 9.30
E1 7.20
7.60 0.291
9.50 0.366
7.40 0.283
0.299
0.374
0.291
E2 7.20
E3 6.10
E4 5.90
7.60 0.283
6.35 0.240
6.10 0.232
0.299
0.250
0.240
e
1.27
0.05
F 1.25
1.35 0.049
0.053
H 13.80
14.40 0.543
0.567
h
0.50
0.019
L 1.20
1.80 0.047
0.071
Q
1.70
0.067
a 0°
8° 0°
8°
Figure 8. Footprint (dimensions in mm)
0.54 - 0.60
1.27
9.5
0.67 - 0.73
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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