LMA246 View Datasheet(PDF) - Filtronic PLC
Part Name
Description
MFG CO.
'LMA246' PDF : 4 Pages View PDF
• ASSEMBLY DRAWING
LMA246
LOW NOISE PHEMT MMIC
Notes:
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Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C.
Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 12/05/00
Email: sales@filss.com
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