LOP476 View Datasheet(PDF) - OSRAM GmbH
Part Name
Description
MFG CO.
'LOP476' PDF : 21 Pages View PDF
Version 1.1
Recommended Solder Pad 9) page 19
Empfohlenes Lötpaddesign 9) Seite 19
Reflow soldering
Reflow-Löten
Padgeometrie für verbesserte Wärmeableitung
Paddesign for improved heat dissipation
3.6 (0.142)
2.6 (0.102)
LO P476
(0.5 (0.020))
(ø2.1 (0.083) +0.1 (0.004))
Bauteil positioniert, Rückseite
Component location on pad, backside
Lötstoplack
Solder resist
Recommended Solder Pad 9) page 19
Empfohlenes Lötpaddesign 9) Seite 19
0.7 (0.028)
Hole in PCB
2.6 (0.102)
OHAY1307
Reflow soldering
Reflow-Löten
ø2.3 (0.091)
Note:
2013-06-12
Lötstoplack
Solder resist
Kein Lötstoplack; kein Kupfer
No solder resist; no copper pad
OHAY2629
The lower solder pad layout represents the
recommended solder pad for top mounting.
11
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