LPC1104 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'LPC1104' PDF : 43 Pages View PDF
NXP Semiconductors
LPC1102/1104
32-bit ARM Cortex-M0 microcontroller
12. Package outline
WLCSP16: wafer level chip-size package; 16 bumps; body 2.17 x 2.32 x 0.6 mm
LPC1102UK
D
BA
ball A1
index area
A2
E
A
A1
e1
1/2 e
e
b
∅v C A B
∅w C
D
C
B
A
ball A1
1
2
3
4
index area
e
1/2 e
e2
Dimensions
0
1
2 mm
scale
Unit
A A1 A2 b D E e e1 e2 v w y
max 0.65 0.27 0.38 0.35 2.21 2.36
mm nom 0.60 0.24 0.36 0.32 2.17 2.32 0.5 1.5 1.5 0.15 0.05 0.05
min 0.55 0.21 0.34 0.29 2.13 2.28
Outline
version
IEC
LPC1102UK
---
References
JEDEC
JEITA
---
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Fig 24. Package outline LPC1102UK (WLCSP16)
LPC1102_1104
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 26 September 2013
detail X
C
y
X
European
projection
lpc1102uk_po
Issue date
10-10-15
10-10-18
© NXP B.V. 2013. All rights reserved.
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