NXP Semiconductors
LPC2212/2214
16/32-bit ARM microcontrollers
10. Package outline
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
c
y
X
108
109
A
73
72
ZE
e
144
1
E HE
A A2
A1
pin 1 index
wM
bp
37
36
e
bp
wM
ZD
D
HD
vM A
B
vM B
detail X
(A 3)
θ
Lp
L
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c D(1) E(1) e
HD HE L
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
20.1
19.9
22.15 22.15
0.5 21.85 21.85
1
Lp v
w
y
Z D(1)
Z
(1)
E
θ
0.75
0.45
0.2
0.08 0.08
1.4
1.1
1.4
1.1
7o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT486-1
IEC
136E23
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-03-14
03-02-20
Fig 17. Package outline SOT486-1 (LQFP144)
LPC2212_2214_4
Product data sheet
Rev. 04 — 3 January 2008
© NXP B.V. 2008. All rights reserved.
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