LSM330DLCTR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'LSM330DLCTR' PDF : 66 Pages View PDF
LSM330DLC
Application hints
5.2
Soldering information
The LGA package is compliant with ECOPACK®, RoHS and “Green” standards. It is
qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Doc ID 022162 Rev 2
31/66
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