LT1055CH View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LT1055CH' PDF : 20 Pages View PDF
PACKAGE DESCRIPTIO
LT1055/LT1056
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
REFERENCE
PLANE
0.016 – 0.021**
(0.406 – 0.533)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.200
(5.080)
TYP
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
H8(TO-5) 0.200 PCD 1197
OBSOLETE PACKAGE
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.400*
(10.160)
MAX
8
7
6
5
.255 ± .015*
(6.477 ± 0.381)
.300 – .325
(7.620 – 8.255)
12
.045 – .065
(1.143 – 1.651)
34
.130 ± .005
(3.302 ± 0.127)
.008 – .015
(0.203 – 0.381)
.065
(1.651)
TYP
+.035
.325 –.015
( ) 8.255
+0.889
–0.381
.100
(2.54)
BSC
NOTE:
1. DIMENSIONS
ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.120
(3.048)
MIN
.018 ± .003
(0.457 ± 0.076)
.020
(0.508)
MIN
N8 1002
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
10556fc
15
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