LT1129CS8-3.3TR View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LT1129CS8-3.3TR' PDF : 16 Pages View PDF
LT1129/LT1129-3.3/LT1129-5
PACKAGE DESCRIPTION
.060
(1.524)
.256
(6.502)
.060
(1.524)
.183
(4.648)
Q Package
5-Lead Plastic DD Pak
(LTC DWG # 05-08-1461)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
15° TYP
.330 – .370
(8.382 – 9.398)
.165 – .180
(4.191 – 4.572)
.059
(1.499)
TYP
.075
(1.905)
.300
(7.620)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
.143
+.012
–.020
( ) 3.632
+0.305
–0.508
.067
(1.702)
.028 – .038 BSC
(0.711 – 0.965)
TYP
.013 – .023
(0.330 – 0.584)
.045 – .055
(1.143 – 1.397)
.004
+.008
–.004
( ) 0.102
+0.203
–0.102
.095 – .115
(2.413 – 2.921)
.050 ± .012
(1.270 ± 0.305)
Q(DD5) 0502
.420
.080
.420
.276
.350
.565
.090
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.325
.205
.565
.320
.090
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
14
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
112935ff
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