LT1129CST-3.3 View Datasheet(PDF) - Linear Integrated System
Part Name
Description
MFG CO.
'LT1129CST-3.3' PDF : 16 Pages View PDF
PACKAGE DESCRIPTIO
LT 1129/LT 1129-3.3/LT 1129-5
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
.050 BSC
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.053 – .069
(1.346 – 1.752)
.245
MIN
.160 ±.005 .228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.014 – .019
(0.355 – 0.483)
TYP
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
34
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
.016 – .050
(0.406 – 1.270)
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
0°– 8° TYP
SO8 0303
.248 – .264
(6.30 – 6.71)
.114 – .124
(2.90 – 3.15)
ST Package
3-Lead Plastic SOT-223
(LTC DWG # 05-08-1630)
.059 MAX
.129 MAX
.264 – .287
(6.70 – 7.30)
.130 – .146
(3.30 – 3.71)
.0905
(2.30)
BSC
.071
(1.80)
MAX
.024 – .033
(0.60 – 0.84)
.181
(4.60)
BSC
.248 BSC
.039 MAX
.059 MAX
.033 – .041
(0.84 – 1.04)
.090
BSC
.181 MAX
RECOMMENDED SOLDER PAD LAYOUT
10° – 16°
10°
MAX
.010 – .014
(0.25 – 0.36)
.012
(0.31)
MIN
.0008 – .0040
(0.0203 – 0.1016)
10° – 16°
ST3 (SOT-233) 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
112935fc
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