PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
.050 BSC
.045 ยฑ.005
.189 โ .197
(4.801 โ 5.004)
NOTE 3
8
7
6
5
LT1468-2
.245
MIN
.160 ยฑ.005
.228 โ .244
(5.791 โ 6.197)
.150 โ .157
(3.810 โ 3.988)
NOTE 3
.030 ยฑ.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
.010
(0.254
โ
โ
.020
0.508)
ร
45ยฐ
.008 โ .010
(0.203 โ 0.254)
0ยฐโ 8ยฐ TYP
.053 โ .069
(1.346 โ 1.752)
.016 โ .050
(0.406 โ 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 โ .019
(0.355 โ 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
34
.004 โ .010
(0.101 โ 0.254)
.050
(1.270)
BSC
SO8 0303
.005
(0.127)
MIN
PIN NO. 1
IDENT
.520
(13.208)
MAX
8
7
6
5
1
2
34
DD Package
8-Lead (3mm ร 3mm) Plastic DFN
(LTC DWG # 05-08-1210)
.020 โ .060
(0.508 โ 1.524)
.485
(12.319)
MAX
.165
(4.191)
MAX
.290
(7.366)
TYP
.008 โ .015
(0.203 โ 0.381)
.300
(7.620)
REF
.125 .054
(3.175) (1.372)
MIN TYP
.100
(2.54)
.015 โ .023 BSC
(0.381 โ 0.584)
D8 0801
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
14682f
11