LT1723IMS8 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LT1723IMS8' PDF : 16 Pages View PDF
LT1722/LT1723/LT1724
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
.010
(0.254
–
–
.020
0.508)
s
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
34
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
SO8 0303
0.889 ± 0.127
(.035 ± .005)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
0.18
(.007)
SEATING
NOTE:
PLANE
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
1 234
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
16
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.86
(.034)
REF
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS8) 0307 REV F
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