LT1769IGN View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LT1769IGN
Linear Technology
'LT1769IGN' PDF : 16 Pages View PDF
LT1769
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage
(VCC, CLP and CLN Pin Voltage) ......................... 30V
BOOST Pin Voltage with Respect to VCC ................. 25V
IBAT (Average)........................................................... 2A
Operating Junction Temperature Range
Commercial ........................................... 0°C to 125°C
Industrial ......................................... – 40°C to 125°C
Operating Ambient Temperature
Commercial ............................................ 0°C to 70°C
Industrial ........................................... – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
PACKAGE/ORDER INFORMATION
TOP VIEW
GND** 1
GND** 2
GND** 3
SW 4
BOOST 5
UV 6
GND** 7
GND** 8
OVP 9
CLP 10
CLN 11
COMP1 12
SENSE 13
GND** 14
28 GND**
27 GND**
26 GND**
25 VCC1*
24 VCC2*
23 VCC3*
22 GND**
21 PROG
20 VC
19 UVOUT
18 COMP2
17 BAT
16 SPIN
15 GND**
GN PACKAGE
28-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 35°C/ W**
ORDER PART
NUMBER
LT1769CGN
LT1769IGN
*ALL VCC PINS SHOULD
BE CONNECTED
TOGETHER CLOSE TO
THE PINS
** ALL GND PINS ARE
FUSED TO INTERNAL DIE
ATTACH PADDLE FOR
HEAT SINKING. CONNECT
THESE PINS TO
EXPANDED PC LANDS
FOR PROPER HEAT
SINKING. 35°C/W
THERMAL RESISTANCE
ASSUMES AN INTERNAL
GROUND PLANE
DOUBLING AS A HEAT
SPREADER
Consult LTC Marketing for parts specified with wider operating temperature ranges.
TOP VIEW
SW 1
BOOST 2
UV 3
GND 4
GND 5
OVP 6
CLN 7
CLP 8
COMP1 9
SENSE 10
20 GND
19 VCC1
18 VCC2
17 VCC3
16 PROG
15 VC
14 GND
13 UVOUT
12 BAT
11 SPIN
FE PACKAGE
20-LEAD PLASTIC TSSOP
TJMAX = 125°C, θJA = 35°C/ W†
EXPOSED PAD IS GROUND
(MUST BE SOLDERED TO PCB)
EXPOSED PAD SIZE:
3.0
(.188)
×
4.1
(.162)
ORDER PART
NUMBER
LT1769CFE
LT1769IFE
†THE BOTTOM METAL
PLATE OF THIS PACKAGE
IS FUSED TO INTERNAL
GROUND AND IS FOR
HEAT SINKING. SOLDER
THE BOTTOM METAL
PLATE ONTO PCB
GROUND PLANE FOR
HEAT SINKING.
ELECTRICAL CHARACTERISTICS The q denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200Ω (see Block Diagram),
VCLN = VCC. No load on any outputs unless otherwise noted.
PARAMETER
Overall
Supply Current
Sense Amplifier CA1 Gain and Input Offset Voltage
(With RS2 = 200Ω, RS3 = 200Ω)
(Measured across RS1)(Note 2)
CONDITIONS
VPROG = 2.7V, VCC ≤ 20V
VPROG = 2.7V, 20V < VCC ≤ 25V
8V ≤ VCC ≤ 25V , 0V ≤ VBAT ≤ 20V
RPROG = 4.93k
RPROG = 49.3k
TA < 0°C
VCC = 28V, VBAT = 20V
RPROG = 4.93k
RPROG = 49.3k
TA < 0°C
MIN TYP MAX
q
4.5
6.8
q
4.6
7.0
q
93
100 107
q
8
10
12
7
13
q
90
110
q
7
13
6
14
2
UNITS
mA
mA
mV
mV
mV
mV
mV
mV
1769fa
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