LT1941 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LT1941' PDF : 24 Pages View PDF
LT1941
PACKAGE DESCRIPTION
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
4.75
(.187)
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
28 2726 25 24 23 22 21 20 19 18 1716 15
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 ±0.10
2.74
(.108)
6.40
(.252)
BSC
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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