DG - 992004
7. Soldering
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No.
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7; 1.Reflowsoldering
(1) It is not recommendedto exceedthesolderingtemperatureandtimeshownbelow.
Causedby substratebendor the othermechanicasltressduringreflow soldering
mayhappengold wire disconnectionetc.Thereforepleasecheckandstudyyour
solderreflow machine’sbestcondition.
(2) Reflow solderingtemperatureprofile
to bedoneunderthe following condition.
1 DedY99
PAGE
l2/13
_
--.-.
.,-> ‘2X4 :
140-160
g
Time(s)
RecommendabTlehermaMl odel
(3) RecommendablMe etal ~Maskpatternfor screenprint
Recommend0.3m.mto 0.5~1 thicknessmetalmask
for screenprint Causedby solderreflow$ondition,
solderpaste, substrateandthe othermaterialetc.,
may changesolderbility.
Pleasecheckandstudy actualsolderbilitybefore
usage.
*Center of the moduct
1 1.2 1llO/ 1.24
r- -r-
-
Recommended soldar pattern (Unir:mxn)