LT3083MPFETRPBF View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LT3083MPFETRPBF' PDF : 28 Pages View PDF
PACKAGE DESCRIPTION
Q PQacPkaacgkeage
5-L5e-aLdeaPdlaPsltaicstDicDDPDa-PkAK
(Refe(RreenfecreenLcTeCLDTCWDGW#G0#5-0058--0184-61416R1eRveEv)E)
LT3083
.256
(6.502)
.060
(1.524)
.060
(1.524)
TYP
.060
(1.524)
.183
(4.648)
.330 – .370
(8.382 – 9.398)
.075
(1.905)
.300
(7.620)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
.143
+.012
–.020
( ) 3.632
+0.305
–0.508
.390 – .415
(9.906 – 10.541)
15° TYP
.165 – .180
(4.191 – 4.572)
.059
(1.499)
TYP
.067
(1.702)
.028 – .038 BSC
(0.711 – 0.965)
TYP
.013 – .023
(0.330 – 0.584)
.045 – .055
(1.143 – 1.397)
.004
+.008
–.004
( ) 0.102
+0.203
–0.102
.095 – .115
(2.413 – 2.921)
.050 ± .012
(1.270 ± 0.305)
.420
.080
.420
.276
.350
.585
.090
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.325
.205
.585
.320
.090
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
Q(DD5) 0610 REV E
3083fa
25
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