LT6703-2/LT6703-3
LT6703HV-2/LT6703HV-3
PACKAGE DESCRIPTION
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635 Rev B)
0.62
0.95
MAX
REF
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
1.90 BSC
S5 TSOT-23 0302 REV B
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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