LTC1061
PACKAGE DESCRIPTIO
J Package
20-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
.045 – .065
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
.300 BSC
(7.62 BSC)
1.060
(26.924)
MAX
20 19 18 17 16 15 14 13 12 11
.220 – .310 .025
(5.588 – 7.874) (0.635)
RAD TYP
1 2 3 4 5 6 7 8 9 10
.005
(0.127)
MIN
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.008 – .018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
.125
(3.175)
MIN
.045 – .065
(1.143 – 1.651)
.014 – .026
(0.356 – 0.660)
OBSOLETE PACKAGE
.100
(2.54)
BSC
J20 0801
N Package
20-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
1.060*
(26.924)
MAX
20 19 18 17 16 15 14 13 12 11
.255 ± .015*
(6.477 ± 0.381)
.300 – .325
(7.620 – 8.255)
.125 – .145
(3.175 – 3.683)
1 2 3 4 5 6 7 8 9 10
.045 – .065
(1.143 – 1.651)
.008 – .015
(0.203 – 0.381)
.020
(0.508)
MIN
+.035
.325 –.015
( ) 8.255
+0.889
–0.381
.120
(3.048)
MIN
.005
(0.127)
MIN
NOTE:
1. DIMENSIONS
ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
.065
(1.651)
TYP
.018 ± .003
(0.457 ± 0.076)
N20 0405
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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