PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
N Package
16-Lead Plastic DIP
0.770
(19.558)
MAX
16 15 14 13 12 11 10 9
0.260 ± 0.010
(6.604 ± 0.254)
LTC1386
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325 –0.015
( ) 8.255
+0.635
–0.381
12
3
4
5
6
78
0.130 ± 0.005
(3.302 ± 0.127)
0.045 – 0.065
(1.143 – 1.651)
0.015
(0.381)
MIN
0.065
(1.651)
TYP
0.125
(3.175)
MIN
0.045 ± 0.015
(1.143 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
N16 0492
S Package
16-Lead Plastic SOIC
0.386 – 0.394*
(9.804 – 10.008)
16 15 14 13 12 11 10 9
0.228 – 0.244
(5.791 – 6.197)
0.150 – 0.157*
(3.810 – 3.988)
0.010
(0.254
–
–
0.020
0.508)
×
45°
0.008 – 0.010
(0.203 – 0.254)
0° – 8° TYP
1
2
3
4
5
6
7
8
0.053 – 0.069
(1.346 – 1.752)
0.004 – 0.010
(0.101 – 0.254)
0.016 – 0.050
0.406 – 1.270
0.014 – 0.019
(0.355 – 0.483)
0.050
(1.270)
TYP
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
SO16 0893
7