APPLICATIONS INFORMATION
LTC1406
Figure 12b. Suggested Evaluation Circuit Figure 12c. Suggested Evaluation Circuit Figure 12d. Suggested Evaluation Circuit
Board—Component Side Silkscreen
Board—Component Side Layout
Board—Solder Side Layout
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.
GN Package
24-Lead Plastic SSOP (Narrow 0.150)
(LTC DWG # 05-08-1641)
0.337 – 0.344*
(8.560 – 8.738)
24 23 22 21 20 19 18 17 16 15 14 13
0.229 – 0.244
(5.817 – 6.198)
0.150 – 0.157**
(3.810 – 3.988)
1 2 3 4 5 6 7 8 9 10 11 12
0.007 – 0.0098
(0.178 – 0.249)
0.015
(0.38
±
±
0.004
0.10)
×
45°
0° – 8° TYP
0.016 – 0.050
(0.406 – 1.270)
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
0.053 – 0.068
(1.351 – 1.727)
0.008 – 0.012
(0.203 – 0.305)
0.025
(0.635)
BSC
0.004 – 0.0098
(0.102 – 0.249)
GN24 (SSOP) 1197
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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