LTC1435A View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC1435A' PDF : 20 Pages View PDF
LTC1435A
APPLICATIONS INFORMATION
4. Does the (+) plate of CIN connect to the drain of the
topside MOSFET(s) as closely as possible? This capaci-
tor provides the AC current to the MOSFET(s).
5. Is the INTVCC decoupling capacitor connected closely
betweenINTVCC and the power ground pin? This capaci-
tor carries the MOSFET driver peak currents.
6. Keep the switching node SW away from sensitive small-
signal nodes. Ideally the switch node should be placed
at the furthest point from the LTC1435A.
7. SGND should be exclusively used for grounding exter-
nal components on COSC, ITH, VOSENSE and SFB pins.
8. If operating close to the minimum on-time limit, is the
sense resistor oriented on the radial axis of the induc-
tor? See Figure 8.
+
COSC
1
CSS
COSC
2
RUN/SS
16
TG
BOOST 15
M1
CIN
RC
CC1
3
ITH
SW 14
VIN
CC2
4 SFB LTC1435A
VIN 13
CB
DB
0.1µF
D1
5
12
SGND
INTVCC
–
100pF
6
VOSENSE
BG 11
+
4.7µF
M2
7 SENSE–
PGND 10
1000pF
8 SENSE+
EXTVCC 9
L1
–
R1
COUT
R2
RSENSE
BOLD LINES INDICATE
HIGH CURRENT PATHS
Figure 10. LTC1435A Layout Diagram
VOUT
+
1435A F10
TYPICAL APPLICATIONS
Intel Mobile CPU VID Power Converter
COSC
43pF
CSS
0.1µF
CC2
220pF
1
2
3
CC
1000pF
RC
10k
5
50pF 6
COSC
13
VIN
VIN
4.5V TO 22V
4.7Ω
RUN/SS
TG
ITH
SW
LTC1435A
INTVCC
SGND
BOOST
16
CF
14
0.1µF
DB
12 CMDSH-3
0.22µF
15
+
M1
Si4410
L1
3.3µH
VOSENSE
SENSE–
11
BG
10
PGND
SENSE+
4.7µF
M2
Si4410
+ CIN
10µF
30V
×2
D1
MBRS140T3
7 1000pF 8
RSENSE
0.015Ω
3
VCC
6
SENSE
LTC1706-19
5
FB
VID
0 1 2 3 GND
7812 4
FROM µP
VOUT
1.3V TO 2.0V
7A
+ COUT
820µF
4V
×2
16
1435A TA07
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