LTC1709 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC1709
Linear Technology
'LTC1709' PDF : 28 Pages View PDF
LTC1709
PI FU CTIO S
AMPMD (Pin 23): This Logic Input pin controls the
connections of internal precision resistors that configure
the operational amplifier as a unity-gain differential
amplifier.
TG2, TG1 (Pins 24, 35): High Current Gate Drives for Top
N-Channel MOSFETS. These are the outputs of floating
drivers with a voltage swing equal to INTVCC superim-
posed on the switch node voltage SW.
SW2, SW1 (Pins 25, 34): Switch Node Connections to
Inductors. Voltage swing at these pins is from a Schottky
diode (external) voltage drop below ground to VIN.
BOOST 2, BOOST 1 (Pins 26, 33): Bootstrapped Supplies
to the Topside Floating Drivers. External capacitors are
connected between the Boost and Switch pins, and Schottky
diodes are connected between the Boost and INTVCC pins.
BG2, BG1 (Pins 27, 31): High Current Gate Drives for
Bottom N-Channel MOSFETS. Voltage swing at these pins
is from ground to INTVCC.
PGND (Pin 28): Driver Power Ground, connect to sources
of bottom N-channel MOSFETS and the (–) terminals of
CIN.
INTVCC (Pin 29): Output of the Internal 5V Linear Low
Dropout Regulator and the EXTVCC Switch. The driver and
control circuits are powered from this voltage source.
Decouple to power ground with a 1µF ceramic capacitor
placed directly adjacent to the IC and minimum of 4.7µF
additional tantalum or other low ESR capacitor.
EXTVCC (Pin 30): External Power Input to an Internal
Switch . This switch closes and supplies INTVCC, bypass-
ing the internal low dropout regulator whenever EXTVCC is
higher than 4.7V. See EXTVCC Connection in the Applica-
tions Information section. Do not exceed 7V on this pin
and ensure VEXTVCC ≤ VIN.
VIN (Pin 32): Main Supply Pin. Should be closely decoupled
to the IC’s signal ground pin.
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