LTC1731-8.2 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC1731-8.2' PDF : 12 Pages View PDF
LTC1731-8.2/LTC1731-8.4
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.206)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.88 ± 0.1
(.192 ± .004)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
GAUGE PLANE
0.53 ± 0.015
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
0.18
(.077)
SEATING
PLANE 0.22 – 0.38
(.009 – .015)
0.65
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.0256)
BCS
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.34)
REF
0.13 ± 0.05
(.005 ± .002)
MSOP (MS8) 1001
10
sn1731 17318fs
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