LTC2264UJ-14 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC2264UJ-14' PDF : 32 Pages View PDF
LTC2265-14/
LTC2264-14/LTC2263-14
PACKAGE DESCRIPTION
UJ Package
40-Lead (6mm × 6mm) Plastic QFN
(Reference LTC DWG # 05-08-1728)
0.70 p 0.05
4.42 p 0.05
4.42 p 0.05
6.50 p 0.05
5.10 p 0.05
4.50 p 0.05
(4 SIDES)
0.25 p 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PACKAGE OUTLINE
6.00 p 0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 6)
0.75 p 0.05
R = 0.10
TYP
4.50 REF
(4-SIDES)
R = 0.115
TYP
39 40
4.42 p 0.10
PIN 1 NOTCH
R = 0.45 OR
0.35 s 45o
CHAMFER
0.40 p 0.10
1
2
4.42 p 0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
(UJ40) QFN REV Ø 0406
0.25 p 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
22654314f
31
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