LTC2668CUJ-16TRPBF View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC2668CUJ-16TRPBF

16-Channel 16-/12-Bit ±10V VOUT SoftSpan DACs with 10ppm/°C Max Reference

Linear Technology 

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LTC2668

Package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

UJ PaUcJkPagacekage

40-Le4a0d-LPelaasdtiPclaQsFtiNc Q(6FmNm(6m× m6m×m6)mm)

(Refere(nRceefeLreTnCceDLWTCGD#W0G5-#080-51-70288-1R72e8v RØe)v Ø)

0.70 ±0.05

4.42 ±0.05

4.42 ±0.05

6.50 ±0.05

5.10 ±0.05

4.50 ±0.05

(4 SIDES)

0.25 ±0.05

0.50 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

PACKAGE OUTLINE

6.00 ±0.10

(4 SIDES)

PIN 1 TOP MARK

(SEE NOTE 6)

0.75 ±0.05

R = 0.10

TYP

4.50 REF

(4-SIDES)

R = 0.115

TYP

39 40

4.42 ±0.10

PIN 1 NOTCH

R = 0.45 OR

0.35 × 45°

CHAMFER

0.40 ±0.10

1

2

4.42 ±0.10

0.200 REF

0.00 – 0.05

NOTE:

1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.25 ±0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

(UJ40) QFN REV Ø 0406

2668fa

26

For more information www.linear.com/LTC2668

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