LTC2856 View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC2856

20Mbps and Slew Rate Limited 15kV RS485/RS422 Transceivers

Linear Technology 

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LTC2856-1/LTC2856-2

LTC2857-1/LTC2857-2

LTC2858-1/LTC2858-2

PACKAGE DESCRIPTION

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698)

0.675 p0.05

3.5 p0.05

1.65 p0.05

2.15 p0.05 (2 SIDES)

PACKAGE

OUTLINE

0.25 p 0.05

0.50

BSC

2.38 p0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

R = 0.115

TYP

5

0.38 p 0.10

8

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

3.00 p0.10

(4 SIDES)

1.65 p 0.10

(2 SIDES)

0.75 p0.05

0.00 – 0.05

4

0.25 p 0.05

(DD) DFN 1203

1

0.50 BSC

2.38 p0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

16

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