LTC2921CGN View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC2921CGN

Power Supply Tracker with Input Monitors

Linear Technology 

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PACKAGE DESCRIPTIO

1.05 ±0.10

LTC2921/LTC2922 Series

F Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1650)

6.40 – 6.60*

(.252 – .260)

20 19 18 17 16 15 14 13 12 11

6.60 ±0.10

4.50 ±0.10

6.40

BSC

0.45 ±0.05

0.65 TYP

RECOMMENDED SOLDER PAD LAYOUT

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2.

DIMENSIONS

ARE

IN

MILLIMETERS

(INCHES)

3. DRAWING NOT TO SCALE

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

4.30 – 4.50**

(.169 – .177)

0.09 – 0.20

(.0036 – .0079)

0.45 – 0.75

(.018 – .030)

0° – 8°

1 2 3 4 5 6 7 8 9 10

1.10

(.0433)

MAX

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

0.05 – 0.15

(.002 – .006)

F20 TSSOP 0502

.254 MIN

.045 ±.005

.150 – .165

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)

.189 – .196*

(4.801 – 4.978)

16 15 14 13 12 11 10 9

.009

(0.229)

REF

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

.0165 ± .0015

.0250 TYP

RECOMMENDED SOLDER PAD LAYOUT

NOTE:

1. CONTROLLING DIMENSION: INCHES

2.

DIMENSIONS

ARE

IN

INCHES

(MILLIMETERS)

.015 ± .004

(0.38 ± 0.10)

×

45°

.007 – .0098

3. DRAWING NOT TO SCALE

(0.178 – 0.249)

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

.016 – .050

(0.406 – 1.270)

1 234 5678

0° – 8° TYP

.053 – .068

(1.351 – 1.727)

.004 – .0098

(0.102 – 0.249)

.008 – .012

(0.203 – 0.305)

.0250

(0.635)

BSC

GN16 (SSOP) 0502

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

29212fa

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