LTC2926IUFD View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC2926IUFD' PDF : 28 Pages View PDF
PACKAGE DESCRIPTIO
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711)
0.70 ±0.05
4.50 ± 0.05
2.65 ± 0.05
3.10 ± 0.05 (2 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.65 ± 0.05
(2 SIDES)
4.10 ± 0.05
5.50 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
PIN 1
TOP MARK
(NOTE 6)
5.00 ± 0.10
(2 SIDES)
3.65 ± 0.10
(2 SIDES)
LTC2926
2.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
19 20
PIN 1 NOTCH
R = 0.30 TYP
0.40 ± 0.05
1
2
0.200 REF
0.00 – 0.05
(UFD20) QFN 0304
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
2926fa
27
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