LTC2970/LTC2970-1
PACKAGE DESCRIPTIO
UFD Package
24-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1696)
4.50 ± 0.05
3.10 ± 0.05
2.65 ± 0.05
(2 SIDES)
0.70 ±0.05
4.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
5.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
3.65 ± 0.10
(2 SIDES)
2.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.30 TYP
0.40 ± 0.05
1
2
0.25 ±0.05
0.50 BSC
3.65 ± 0.05
(2 SIDES)
4.10 ± 0.05
5.50 ± 0.05
PACKAGE OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.200 REF
0.00 – 0.05
(UFD24) QFN 0505
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
TYPICAL APPLICATIO
+
VOUT
–
8V TO 15V
22μF
10Ω
12VIN
VDD
LTC2970
VIN1_AP
VIN1_AM
VIN0_AP
VIN0_AM
VOUT1
ALERT
SCL
SDA
IOUT1
100Ω
VOUT0
IOUT0
REF
12.7k GND ASEL0 ASEL1
0.1μF
0.1μF
I2C BUS
0.1μF
29701 F07
Figure 7. Programmable Reference Application Circuit
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
29701fc
35