LTC3225 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC3225' PDF : 14 Pages View PDF
LTC3225/LTC3225-1
PACKAGE DESCRIPTION
DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev Ø)
0.64 p0.05
(2 SIDES)
2.55 p0.05
1.15 p0.05
0.70 p0.05
0.25 p 0.05
0.50 BSC
2.39 p0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 p0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
6
0.40 p 0.10
10
2.00 p0.10
(2 SIDES)
0.75 p0.05
0.64 p 0.05
(2 SIDES)
5
0.25 p 0.05
PIN 1
R = 0.20 OR
0.25 s 45o
1
CHAMFER
(DDB10) DFN 0905 REV Ø
0.50 BSC
0 – 0.05
2.39 p0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3225fb
12
Share Link: 
