LTC3718EG View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC3718EG' PDF : 20 Pages View PDF
LTC3718
TYPICAL APPLICATIO
One Half VIN, ±10A Bus Terminator
PGOOD
RPG
100k
CSS
0.1µF X7R
1
24
RUN/SS BOOST
C1
820pF
X7R
RC 4.75k
C2
100pF
RON
237k
2
VON
3
PGOOD
23
TG
22
SW1
4
VRNG
SENSE+ 21
5
ITH
SENSE– 20
6
SGND1
19
PGND1
7
LTC3718
18
ION
BG
8
VFB1
17
INTVCC
9
VREF
16
VIN1
10
SHDN
15
VIN2
11
SGND2
14
PGND2
RF1
12.1k
12
VFB2
RF3
10k
13
SW2
RF2
37.4k
*SANYO POSCAP 4TPB470M
**SUMIDA CEP125-0R8MC
***PANASONIC ELJPC4R7MF
****SANYO POSCAP 6TPB330M
CF4
1000pF X7R
DB
CMDSH-3
CB 0.33µF
X7R
CIN1
22µF X5R
×2
M1
Si7440DP
D1
B340A
VIN
2.5V
CIN2****
330µF
L1**
0.8µH
M2
Si7440DP
D2
B340A
+ COUT*
470µF
×2
VOUT
1.25V
±10A
22µF
X5R
4.7µF
6.3V X7R
CVCC1
10µF 6.3V
X5R
L2***
4.7µH
D3
MBR0520
3718 TA02
PACKAGE DESCRIPTIO
7.8 – 8.2
G Package
24-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
1.25 ±0.12
7.90 – 8.50*
(.311 – .335)
24 23 22 21 20 19 18 17 16 15 14 13
5.3 – 5.7
7.40 – 8.20
(.291 – .323)
0.42 ±0.03
0.65
RECOMMENDED SOLDER PAD LAYOUT BSC
5.00 – 5.60**
(.197 – .221)
0° – 8°
1 2 3 4 5 6 7 8 9 10 11 12
2.0
(.079)
0.09 – 0.25
(.0035 – .010)
NOTE:
0.55 – 0.95
(.022 – .037)
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
0.05
(.002) G24 SSOP 0802
1. CONTROLLING DIMENSION: MILLIMETERS *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
SHALL NOT EXCEED .152mm (.006") PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
3. DRAWING NOT TO SCALE
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3718fa
19
Share Link: 
