LTC3732 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC3732
Linear Technology
'LTC3732' PDF : 28 Pages View PDF
PACKAGE DESCRIPTIO
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
0.70 ± 0.05
5.50 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
3.20 ± 0.05
(2 SIDES)
LTC3732
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
5.20 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
0.75 ± 0.05
0.00 – 0.05
PACKAGE
OUTLINE
3.15 ± 0.10
(2 SIDES)
37 38
0.435 0.18
0.18
1
0.23
2
7.00 ± 0.10
(2 SIDES)
5.15 ± 0.10
(2 SIDES)
0.75 ± 0.05
0.200 REF
0.00 – 0.05
0.200 REF 0.25 ± 0.05
0.50 BSC
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
0.40 ± 0.10
(UH) QFN 0303
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3732f
27
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