LTC3770 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC3770
Linear Technology
'LTC3770' PDF : 24 Pages View PDF
PACKAGE DESCRIPTION
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
1.25 p 0.12
9.90 – 10.50*
(.390 – .413)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
LTC3770
7.8 – 8.2
5.3 – 5.7
7.40 – 8.20
(.291 – .323)
0.42 p 0.03
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
5.00 – 5.60**
(.197 – .221)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
G28 SSOP 0204
2.0
(.079)
MAX
0° – 8°
0.09 – 0.25
(.0035 – .010)
0.55 – 0.95
(.022 – .037)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
0.05
(.002)
MIN
5.50 p 0.05
4.10 p 0.05
3.50 REF
(4 SIDES)
3.45 p 0.05
3.45 p 0.05
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693 Rev D)
0.70 p 0.05
5.00 p 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 p 0.05
R = 0.05
TYP
0.00 – 0.05
3.50 REF
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 s 45o CHAMFER
31 32
0.40 p 0.10
1
2
3.45 p 0.10
3.45 p 0.10
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
0.200 REF
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 p 0.05
0.50 BSC
(UH32) QFN 0406 REV D
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3770fc
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