LTC3776EUF View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC3776EUF

Dual 2-Phase, No RSENSE™, Synchronous Controller for DDR/QDR Memory Termination

Linear Technology 

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LTC3776

PACKAGE DESCRIPTIO

UF Package

24-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1697)

0.70 ±0.05

4.50 ± 0.05

2.45 ± 0.05

3.10 ± 0.05 (4 SIDES)

PACKAGE OUTLINE

0.25 ±0.05

0.50 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

4.00 ± 0.10

(4 SIDES)

PIN 1

TOP MARK

(NOTE 6)

0.75 ± 0.05

2.45 ± 0.10

(4-SIDES)

BOTTOM VIEW—EXPOSED PAD

R = 0.115

TYP

23 24

PIN 1 NOTCH

R = 0.20 TYP OR

0.35 × 45° CHAMFER

0.40 ± 0.10

1

2

(UF24) QFN 0105

0.200 REF

0.25 ± 0.05

0.00 – 0.05

0.50 BSC

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

3776f

26

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