LTC4097 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC4097' PDF : 20 Pages View PDF
LTC4097
PACKAGE DESCRIPTION
DDB Package
12-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1723 Rev Ø)
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
7
0.40 ± 0.10
12
2.55 ±0.05
1.15 ±0.05
0.25 ± 0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.64 ± 0.10
(2 SIDES) 6
0.23 ± 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
1
(DDB12) DFN 0106 REV Ø
0.45 BSC
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0 – 0.05
2.39 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4097f
19
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