LTC4306C View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC4306C' PDF : 20 Pages View PDF
PACKAGE DESCRIPTIO
UFD Package
24-Lead Plastic QFN (4mm x 5mm)
(Reference LTC DWG # 05-08-1696)
4.50 ± 0.05
3.10 ± 0.05
2.65 ± 0.05
(2 SIDES)
0.70 ±0.05
5.00 ± 0.10
(2 SIDES)
4.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
3.65 ± 0.10
(2 SIDES)
LTC4306
2.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.30 TYP
0.40 ± 0.05
1
2
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
3.65 ± 0.05
(2 SIDES)
4.10 ± 0.05
5.50 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.200 REF
0.00 – 0.05
(UFD24) QFN 0505
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
.254 MIN
GN Package
24-Lead Plastic SSOP
(Reference LTC DWG # 05-08-1641)
.045 ±.005
.337 – .344*
(8.560 – 8.738)
24 23 22 21 20 19 18 17 16 15 1413
.033
(0.838)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
RECOMMENDED SOLDER PAD LAYOUT
.0250 BSC
1 2 3 4 5 6 7 8 9 10 11 12
.0075 – .0098
(0.19 – 0.25)
.015 ± .004
(0.38 ± 0.10)
×
45°
0° – 8° TYP
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN24 (SSOP) 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4306f
19
Share Link: 
