LTC4307
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD8) DFN 1203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
4307f
14