LTC5540 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC5540' PDF : 16 Pages View PDF
Package Description
UH Package
20-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1818 Rev Ø)
LTC5540
5.50 p 0.05
4.10 p 0.05
2.60 REF
2.70 p 0.05
2.70 p 0.05
0.70 p0.05
PACKAGE
OUTLINE
0.25 p0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 p 0.10
0.75 p 0.05
PIN 1
TOP MARK
(NOTE 6)
5.00 p 0.10
R = 0.05
TYP
R = 0.125
TYP
19 20
2.60 REF
2.70 p 0.10
2.70 p 0.10
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
0.40 p 0.10
1
2
(UH20) QFN 0208 REV Ø
0.200 REF
0.25 p 0.05
0.00 – 0.05
0.65 BSC
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
BOTTOM VIEW—EXPOSED PAD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5540f
15
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