LTC5582 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC5582' PDF : 16 Pages View PDF
Package Description
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
LTC5582
0.70 p0.05
3.55 p0.05
1.65 p0.05
2.15 p0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 p 0.05
0.50
BSC
2.38 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.125
TYP
6
0.40 p 0.10
10
3.00 p0.10 1.65 p 0.10
(4 SIDES) (2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.75 p0.05
0.00 – 0.05
(DD) DFN REV B 0309
5
1
0.25 p 0.05
0.50 BSC
2.38 p0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5582f
15
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