LTM4604AV View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTM4604AV' PDF : 22 Pages View PDF
LTM4604A
Applications Information
Safety Considerations
The LTM4604A µModule regulator does not provide
galvanic isolation from VIN to VOUT. There is no internal
fuse. If required, a slow blow fuse with a rating twice the
maximum input current needs to be provided to protect
each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4604A makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path,
including VIN, GND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capacitors
next to the VIN, GND and VOUT pins to minimize high
frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put vias directly on the pads unless they are
capped.
• SW pads can be soldered to board to improve thermal
performance.
Figure 14 gives a good example of the recommended layout.
GND
VOUT
COUT
COUT
COUT
VIN
2.375V TO 5.5V
CIN
10µF
6.3V
X5R OR X7R
OPEN-DRAIN
PULL UP
CSSEXT
0.01µF
VIN
PGOOD VOUT
LTM4604A
COMP
FB
RUN/SS TRACK
GND
RFB
5.69k
VOUT
1.5V
4A
COUT
22µF ×3
6.3V
X5R OR X7R
4604A F15
Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design
VIN
CIN
GND
4604A F14
Figure 14. Recommended PCB Layout (LGA Shown,
for BGA Use Circle Pads)
16
For more information www.linear.com/LTM4604A
4604afc
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