LTM4606 View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTM4606

Ultralow EMI 28VIN, 6A DC/DC µModule

Linear Technology 

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LTM4606

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full internal

operating temperature range, otherwise specifications are at TA = 25°C. VIN = 12V, unless otherwise noted. Per typical application

(front page) configuration, RFB = 40.2k.

SYMBOL

PARAMETER

CONDITIONS

MIN TYP MAX UNITS

VFCB

IFCB

tON(MIN)

tOFF(MIN)

RPLLIN

IDRVCC

RFBHI

RUNMAX

Margin Section

Forced Continuous Threshold

Forced Continuous Pin Current

Minimum On Time

VFCB = 0V

(Note 3)

Minimum Off Time

(Note 3)

PLLIN Input Resistor

Current into DRVCC Pin

Resistor Between VOUT and VFB Pins

Volts From RUN to GND Maximum

VOUT = 1.5V, IOUT = 1A

5.1V Zener Clamp

0.57

0.6

0.63

V

–1

–2

μA

50

100

ns

250

400

ns

50

kΩ

15

25

mA

60.098 60.4 60.702

kΩ

5

V

MPGM

Margin Reference Voltage Sets a

Current

1.18

V

MARG0, MARG1 Voltage Thresholds

1.4

V

PGOOD

ΔVFBH

ΔVFBL

ΔVFB(HYS)

VPGL

PGOOD Upper Threshold

PGOOD Lower Threshold

PGOOD Hysteresis

PGOOD Low Voltage

VFB Rising

VFB Falling

VFB Returning

IPGOOD = 5mA

7

10

13

%

–7

–10

–13

%

1.5

%

0.15 0.4

V

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTM4606E is guaranteed to meet performance specifications

over the 0°C to 125°C internal operating temperature range. Specifications

over the –40°C to 125°C internal operating temperature range are assured

by design, characterization and correlation with statistical process

controls. The LTM4606I is guaranteed to meet specifications over the

–40°C to 125°C internal operating temperature range. The LTM4606MP

is guaranteed and tested over the –55°C to 125°C internal operating

temperature range. Note that the maximum ambient temperature is

determined by specific operating conditions in conjunction with board

layout, the rated package thermal resistance and other environmental

factors.

Note 3: 100% tested at die level only.

Note 4: See output current derating curves for different VIN, VOUT and TA.

4606f

4

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