LTM4607 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTM4607
Linear Technology
'LTM4607' PDF : 24 Pages View PDF
TYPICAL APPLICATIONS
8
7
6
5
4
3
2
1
0
45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C)
36VIN TO 20VOUT WITH 0LFM
36VIN TO 20VOUT WITH 200LFM
36VIN TO 20VOUT WITH 400LFM
4607 F13
Figure 13. 36VIN to 20VOUT without Heat Sink
LTM4607
8
7
6
5
4
3
2
1
0
45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C)
36VIN TO 20VOUT WITH 0LFM
36VIN TO 20VOUT WITH 200LFM
36VIN TO 20VOUT WITH 400LFM
4607 F14
Figure 14. 36VIN to 20VOUT with Heat Sink
APPLICATIONS INFORMATION
Table 4. Boost Mode
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
VOUT (V)
12, 16
12, 16
12, 16
12, 16
12, 16
12, 16
POWER LOSS CURVE
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
none
none
none
BGA Heatsink
BGA Heatsink
BGA Heatsink
θJA (°C/W)*
11.4
8.5
7.5
11.0
7.9
7.1
Table 5. Buck Mode
DERATING CURVE
Figure 11, 13
Figure 11, 13
Figure 11, 13
Figure 12, 14
Figure 12, 14
Figure 12, 14
VOUT (V)
12, 20
12, 20
12, 20
12, 20
12, 20
12, 20
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
none
none
none
BGA Heatsink
BGA Heatsink
BGA Heatsink
θJA (°C/W)*
8.2
5.9
5.4
7.5
5.3
4.8
HEATSINK MANUFACTURER
PART NUMBER
PHONE NUMBER
Wakefield Engineering
LTN20069
603-635-2800
Aaivd Thermalloy
375424B00034G
603-224-9988
*The results of thermal resistance from junction to ambient θJA are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θJA.
4607f
19
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