LTM4616 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTM4616' PDF : 30 Pages View PDF
LTM4616
Applications Information
Layout Checklist/Example
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current paths,
including VIN1, VIN2, GND1 and GND2, VOUT1 and
VOUT2. It helps to minimize the PCB conduction loss
and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the VIN, GND and VOUT pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put vias directly on the pads, unless they are
capped or plated over.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
• For parallel modules, tie the ITH, FB and ITHM pins to-
gether. Use an internal layer to closely connect these
pins together. All of the ITHM pins connect to the SGND
of the master regulator, then the master SGND connects
to GND.
Figure 17 gives a good example of the recommended layout.
VIN1
GND1
VIN2
GND2
VIN1
VIA TO GND
EACH CHANNEL
VOUT1
M
L
CIN1
K
CONTROL1
COUT2
VOUT1
J
H
G
F
E
CIN2
D
CONTROL1 & 2
GND1
COUT2
VOUT2
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12
GND2
CONTROL2
LTM4616 TOP VIEW
GND2
GND2
4616 F17
Figure 17. Recommended PCB Layout
(LGA and BGA PCB Layouts Are Identical with the Exception of Circle Pads for BGA. See Package Description.)
For more information www.linear.com/LTM4616
4616ff
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