M24128-BFCS6G/K View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24128-BFCS6G/K' PDF : 46 Pages View PDF
M24128-BW M24128-BR M24128-BF M24128-DF
Package information
9.5
WLCSP package information
Figure 22. WLCSP - 8-bump, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale
package outline
yz
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1. Drawing is not to scale.
Table 22. WLCSP - 8-bump, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale
package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.500
0.540
0.580
0.0197
0.0213
0.0228
A1
-
0.190
-
-
0.0075
-
A2
-
0.350
-
b(2)
-
0.270
-
-
0.0138
-
-
0.0106
-
D
-
1.289
1.309
-
0.0507
0.0515
E
-
1.099
1.119
-
0.0433
0.0441
e
-
0.80
-
-
0.0315
-
e1
-
0.693
-
-
0.0273
-
e2
-
0.400
-
-
0.0157
-
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