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M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
M24256-BF
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'M24256-BF' PDF : 47 Pages View PDF
DC and AC parameters
M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
Symbol
Table 14. DC characteristics (M24256-BW, device grade 6)
Parameter
Test conditions (in addition to those
in Table 7)
Min.
Max. Unit
ILI
Input leakage current
(SCL, SDA, E2, E1,
E0)
VIN = VSS or VCC, device in Standby
mode
-
±2
µA
ILO
Output leakage
current
SDA in Hi-Z, external voltage applied
on SDA: VSS or VCC
-
VCC = 2.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
-
±2
µA
1
ICC
Supply current (Read)
VCC = 5.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
2.5 V ≤VCC ≤ 5.5 V, fc = 1 MHz(1)
(rise/fall time < 50 ns)
-
2
mA
-
2.5
ICC0
Supply current (Write)
During tW,
2.5 V ≤ VCC ≤ 5.5 V
ICC1
Standby supply
current
Device not selected(3),
VIN = VSS or VCC, VCC = 2.5 V
Device not selected(3),
VIN = VSS or VCC, VCC = 5.5 V
Input low voltage
VIL (SCL, SDA, WC, E2, -
E1, E0)(4)
-
2(2)
mA
-
2
µA
-
3
µA
–0.45 0.3 VCC V
Input high voltage
(SCL, SDA)
-
VIH
Input high voltage
(WC, E2, E1, E0)(5)
-
0.7 VCC 6.5
V
0.7 VCC VCC+0.6 V
VOL Output low voltage
IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V
-
0.4
V
1. Only for devices operating at fC max = 1 MHz (see Table 18).
2. Characterized value, not tested in production.
3. The device is not selected after power-up, after a Read instruction (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a Write instruction).
4. Ei inputs should be tied to Vss (see Section 2.3).
5. Ei inputs should be tied to Vcc (see Section 2.3).
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DS1766 Rev 34
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