M24C02-DRMF3G View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24C02-DRMF3G' PDF : 39 Pages View PDF
M24C02-A125
Package mechanical data
9.3
WFDFPN8 package information
Figure 15.WFDFPN8 (MLP8) – 8-lead, 2 x 3 mm, 0.5 mm pitch very very thin fine pitch
dual flat package outline
3LQ,'PDUNLQJ
'
$%
'DWXP<
3LQ
'
'
H
(
[ DDD #
[ DDD #
7RSYLHZ
6HH=
'HWDLO
(
(
.
1;E
1' [H
%RWWRPYLHZ
EEE - & $ %
GGG - &
/ /
'DWXP<
FFF #
&
HHH # $
6HDWLQJSODQH
$
H
H
/
7HUPLQDOWLS
6LGHYLHZ
'HWDLO³=´
$<B0(B9
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating
(not connected) in the end application.
DocID025755 Rev 5
35/40
39
Share Link: 
