M24C08-F View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24C08-F' PDF : 39 Pages View PDF
Package mechanical data
M24C16, M24C08, M24C04, M24C02, M24C01
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
-"
-#
$
EB
EB
,
, ,
,
%
!
!
%
0IN
%
+
+
,
,
$
EEE
$
:7?-%E
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
Symbol
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
millimeters
inches(1)
Note
Typ
Min
Max
Typ
Min
Max
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
D2 (MB)
1.600
1.500
1.700
0.0630
0.0591
0.0669
D2 (MC)
-
1.200
1.600
-
0.0472
0.0630
E
3.000
2.900
3.100
0.1181
0.1142
0.1220
E2 (MB)
0.200
0.100
0.300
0.0079
0.0039
0.0118
E2 (MC)
-
1.200
1.600
-
0.0472
0.0630
e
0.500
-
-
0.0197
-
-
K
-
0.300
-
-
0.0118
-
L
-
0.300
0.500
-
0.0118
0.0197
L1
-
0.150
-
-
0.0059
L3
-
0.300
-
eee
0.080
-
0.0118
-
0.0031
(2)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Excludes embedding part of exposed die paddle from
measuring.
30/38
Doc ID 5067 Rev 17
Share Link: 
